Canadian Power develops a new type of high-heat-resistant food packaging material

At the Food Technology Center of GueCph University in Ontario, Canada, a new type of PEN polyethylene naphthalene phenolic resin was developed. This new package has the advantages of high heat resistance, resistance to embrittlement, moisture resistance, oxidation resistance and UV radiation resistance. If this PEN polyethylene naphthalene phenol resin material is mixed with the current traditional food packaging material PET polyethylene terephthalate, a new PEN/PET material will be formed. Due to the high heat resistance of new food packaging materials, they can be processed at high temperatures. For example, jams can be hot-packed at 94 degrees Celsius to make foods last longer.